IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

Direct Insight is to offer KaRo’s 27 x 27mm system on module that pairs a 1.2GHz dual-core Arm Cortex-A35 processor with 1Gbyte of LPDDR4, 4Gbyte of eMMC flash and an NPU. Called QSMP-23, “this solder ...

Module Type Package is an exciting technology that stands to make the integration of machines into a higher-level DCS, SCADA or MES significantly easier and faster. It is an open standard and ...

Aimed at applications that need to transition from a microcontroller (MCU) to a microprocessor (MPU) to handle increased processing requirements, Microchip Technology Inc. has expanded its MPU-based ...

Microchip Technology Inc. unveils a new System on Module (SOM) featuring the SAMA5D2 MPU, which greatly simplifies design by integrating the power management, non-volatile boot memory, Ethernet PHY ...

Time is money and shouldn’t ever be wasted. This motto applies to everything, including building technology. That is why System-on-Modules are all the rage right now, as it offers all the features you ...